Clean Room
The Chemistry Cleanroom Facility in the Department of Chemistry provides a Class 1000/ISO Class 6 environment and contains many of the same types of resources found in semiconductor cleanrooms. This includes, Semiconductor photolithography, patterning and wet etching capabilities, Physical Vapor Deposition of metals and Reactive Ion Etching of substrates.
The equipment available for general use includes the following:
- Karl Suss MJB3 mask aligner and 200W exposure system which is capable of patterning sub-micron features.
- Laurell WS650S Spin Processor with Vacuum Chucks suitable for odd -shaped substrates from 0.5" dia. and up to 4" dia. and 1"x 3" microscope slides.
- 6" Bake plate for soft bake of photoresist
- Thermionics Electron Beam Evaporator system with a 4 pocket rotary hearth for deposition of up to 4 different metals.
- Ion and Plasma Equipment (IPE) reactive ion etcher set up for Si/SiO x etching
- Jelight UV-Ozone cleaner for samples and substrates up to 6" square
- Barnstaed Diamond UV/TOC Ultrapure water system for production of Type I (18.2 M-ohm) water with total oxidized carbon levels below 5 ppb .
